Microstrip boards

SDS Electronics offers contract manufacturing of microstrip boards.

Production capabilities:

• Materials: aluminium oxide (Al2O3), ferrite, sitall, quartz, aluminum nitride, etc.
• substrate thickness: 0.15–2.0 mm
• substrate dimensions: from 15×15 mm to 100×100 mm
• minimum topological standards for wet etching (conductor/gap): 50 μm/20 μm
• minimum topological standards for ion-plasma etching (conductor/gap): 5 μm/2 μm
• materials of resistive layers: alloys of PC series, Ta, Cr, Ni, Ni/Cr, Ti, etc.
• adhesion sublayer materials: Ti, Cr, Ta (50 – 300 Ohm/sq.)
• materials of conductive layers: Al, Ag, Au, Pt, Cu
• Thickness of metallization: up to 10 μm
• protective coverings: photoresist, soldermask
• film resistors tolerance: +/-0.1%
• plating of conductive layers on top and bottom sides of substrate
• electroplating coatings: Ag, Au, Cu, Ni
• cutting and scribing: laser, disk cutting